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本书共 5 章，第 1 章为 LCP 材料简介及制备工艺，第 2 章为多层 LCP 电路板中过孔互连结构的研究，第 3章为毫米波射频前端系统中键合线电路的分析与设计，第 4 章为微带线-微带线槽线耦合过渡结构，第 5 章为基于 LCP 无源器件的设计与研究。本书从 LCP 电路的制备工艺讲起，系统地阐述了双层及多层 LCP 电路板的制备过程，以及激光开腔工艺的实现方法，为电路设计工程技术人员提供了工艺参考。同时，本书对多层 LCP 电路板中过孔互连结构的建模进行了深入的讨论，为毫米波宽带电路设计提供了借鉴。为了克服多层 LCP 电路板中过孔不易实现的难题，本书对槽线耦合过渡结构进行了系统研究，并且基于多模耦合理论，设计了毫米波频段的超宽带过渡结构。LCP 无源器件的设计为 LCP 电路系统一体化集成提供了优异的解决方案。本书可作为微波、毫米波电路设计人员的参考资料。

第 1 章 LCP 材料简介及制备工艺 ··············································································1
 1.1 LCP 材料的发展历史 ···················································································.1
1.2 LCP 材料的基本特性 ···················································································.4
1.3 LCP 材料的应用 ·························································································.6
1.4 单层 LCP 基板制备工艺 ·············································································.10
1.5 多层 LCP 基板制备工艺 ·············································································.13
1.6 多层 LCP 基板关键工艺技术 ·······································································.17
1.7 本章总结 ································································································.22
1.8 参考文献 ································································································.22
第 2 章 多层 LCP 电路板中过孔互连结构的研究 ························································24.
2.1 多层 LCP 电路板建模方法的研究 ·································································.24
2.1.1 多层 LCP 电路板建模方法的研究与发展现状 ··············································.24
2.1.2 带有过孔的多层 LCP 电路板建模流程 ·······················································.28
2.2 CPWG-SL-CPWG 过孔互连结构的设计与实现 ················································.30
2.2.1 过孔互连结构的基本模型 ······································································.31
2.2.2 过孔互连结构的仿真设计 ······································································.33
2.2.3 过孔互连结构的匹配优化 ······································································.36
2.2.4 过孔互连结构的表征与测试 ···································································.41
2.3 CPWG-SL-CPWG 过孔互连结构的快速收敛等效电路模型 ·································.42
2.3.1 典型的П型等效电路模型 ······································································.43
2.3.2 П型等效电路模型寄生参数提取 ······························································.44
2.3.3 过孔互连结构的快速收敛等效电路模型的构建 ············································.49
2.3.4 等效电路模型的仿真验证 ······································································.51
2.4 CPWG-SL-CPWG 过孔互连结构的高精度等效电路模型 ····································.53
2.4.1 电源／接地面对过孔传输特性的影响 ························································.54
2.4.2 典型过孔的内在等效电路模型·································································.57
2.4.3 内在等效电路模型的参数提取·································································.59
2.4.4 过孔互连结构的高精度等效电路模型的构建 ···············································.61
2.4.5 等效电路模型的仿真验证 ······································································.62
2.5 本章总结 ································································································.65
2.6 参考文献 ································································································.66
第 3 章 毫米波射频前端系统中键合线电路的分析与设计 ·············································.70
3.1 键合线材料的分析 ····················································································.71
3.2 引线键合技术的简介 ·················································································.72
3.3 键合线等效电路模型的构建 ········································································.74
3.3.1 键合线几何长度的提取 ·········································································.74
3.3.2 键合线寄生参数的提取 ·········································································.77
3.3.3 双线键合的等效电路模型 ······································································.79
3.3.4 键合线结构参数对其传输特性的影响 ························································.80
3.4 Ka 波段键合线匹配电路的设计与实现 ··························································.87
3.4.1 基于微带线的单线键合匹配电路 ······························································.87
3.4.2 基于微带线的双线键合匹配电路 ······························································.94
3.5 W 波段键合线匹配电路的设计与实现 ···························································.99
3.5.1 基于 CPWG 的双线键合匹配电路 ···························································.100
3.5.2 基于 CPWG 的单线键合匹配电路 ···························································.107
3.6 基于 LCP 基板的键合线匹配电路的设计流程 ·················································.112
3.7 本章总结 ·······························································································.113
3.8 参考文献 ·······························································································.114
第 4 章 微带线-微带线槽线耦合过渡结构 ································································.116
4.1 微带线-微带线槽线耦合过渡结构的基本特性 ················································.116
4.1.1 微带线-微带线槽线耦合过渡结构的提出 ··················································.116
4.1.2 微带线-微带线槽线多模谐振器的基本结构 ···············································.117
4.1.3 微带线-微带线槽线多模谐振器的工作原理 ···············································.117
4.1.4 微带线-微带线槽线耦合过渡结构等效电路模型分析 ···································.118
4.2 T 型枝节线槽线耦合过渡结构 ····································································.120
4.2.1 T 型枝节线槽线耦合过渡结构等效电路分析 ··············································.120
4.2.2 均匀双槽线耦合过渡结构的设计 ·····························································.122
4.2.3 T 型枝节线槽线耦合过渡结构的设计 ·······················································.128
4.2.4 T 型枝节线槽线耦合过渡结构的制作工艺 ·················································.132
4.2.5 T 型枝节线槽线耦合过渡结构的表征与测试 ··············································.133
4.3 微带枝节加载槽线耦合过渡结构 ·································································.135
4.3.1 微带枝节加载槽线谐振器的提出 ·····························································.135
4.3.2 微带枝节加载槽线耦合过渡结构的设计 ····················································.136
4.3.3 微带枝节加载槽线耦合过渡结构的表征与测试 ···········································.146
4.4 环形谐振器槽线耦合过渡结构 ····································································.149
4.4.1 环形谐振器均匀双槽线耦合过渡结构的设计 ··············································.149
4.4.2 环形谐振器背对背 Y 型槽线耦合过渡结构的设计 ·······································.150
4.4.3 环形谐振器 H 型槽线耦合过渡结构的设计 ················································.153
4.4.4 环形谐振器槽线耦合过渡结构的表征与测试 ··············································.155
4.5 本章总结 ·······························································································.158
4.6 参考文献 ·······························································································.159
第 5 章 基于 LCP 无源器件的设计与研究 ·······························································.161
5.1 LCP 无源电感的概述 ················································································.161
5.2 LCP 集总参数电感性能的研究 ····································································.164
5.2.1 水平螺旋电感性能的研究 ·····································································.164
5.2.2 平面螺旋电感性能的研究 ·····································································.169
5.2.3 8-shaped 型电感性能的研究 ···································································.175
5.3 LCP 分布式电感性能的研究 ·······································································.178
5.4 垂直叉指电容的概述 ················································································.180
5.5 垂直叉指电容性能的研究 ··········································································.181
5.5.1 电容 型等效电路模型的分析 ·································································.181
5.5.2 二端口电容结构参数的分析 ··································································.183
5.5.3 单端口电容结构参数的分析 ··································································.187
5.6 垂直叉指电容的优化设计 ··········································································.189
5.6.1 带有 DGS 的二端口正方形垂直叉指电容 ··················································.190
5.6.2 带有 DGS 的单端口正方形垂直叉指电容 ··················································.191
5.7 UHF 滤波器设计的概述 ············································································.195
5.8 UHF 集总参数低通滤波器的设计 ································································.197
5.8.1 低通滤波器电路与参数的分析································································.197
5.8.2 低通滤波器的仿真设计 ········································································.198
5.8.3 低通滤波器的实物测试 ········································································.200
5.9 UHF 集总参数带通滤波器的设计 ································································.202
5.9.1 带通滤波器的仿真设计 ········································································.202
5.9.2 带通滤波器的实物测试 ········································································.205
5.10 UHF 半集总参数双通带通滤波器的设计 ·····················································.207
5.10.1 半集总滤波器电路与参数分析 ······························································.207
5.10.2 半集总滤波器的仿真设计 ····································································.210
5.10.3 半集总滤波器的实物测试 ····································································.212
5.11 本章总结 ·····························································································.214
5.12 参考文献 ·····························································································.215

随着无线通信技术的飞速发展，现代电子系统不断向高频化、高密度集成方向发展，LCP以其优异的微波、毫米波特性，被广泛应用于高频多层电路板和电子封装。作为一种崭新的电路集成基板和封装材料，对 LCP 进行关键工艺制备、多层电路板设计，以及多层电路板互连结构建模尤为重要。本书基于当前 LCP 薄膜的高密度系统集成中的关键技术，详细介绍了多层LCP 基板的制造工艺，深入分析了过孔互连结构的宽带等效电路模型、超宽带电磁耦合结构设计，以及自封装无源器件的设计。本书由西安邮电大学刘维红组织编写，张博、陈柳杨、刘烨、刘清冉、关东阳、谢端、吴昊谦参与了本书的编撰工作。其中，刘维红负责本书的构思和策划，并进行相关章节内容的撰写，刘烨协助相关人员进行第2 章内容的修订工作，陈柳杨负责第3 章内容的修订，关东阳负责第4 章内容的修订，刘清冉负责第 5 章内容的修订。张博、谢端、吴昊谦参与了修改工作。由于毫米波射频前端系统集成的飞速发展，急需进行相关封装结构的探索。进行封装结构设计，基板材料的选取及基板的加工技术突破是实现毫米波射频前端模块的关键。基于本课题组及合作企业的前期努力，我们已经实现了多层 LCP 基板的加工，成功在基板中设计并实现了无源、有源芯片的一体化集成，为实现毫米波射频前端模块的设计和产业化提供了坚实的技术支撑。尽管本课题组前期对 LCP 高密度系统集成进行了尝试，但是仍然有更多的研究工作去做，所以存在一些疏漏之处，希望广大读者批评指正。著者

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基于多层LCP基板的高密度系统集成技术